Students pursuing research in field of Packaging |
Full Time Students |
S.No. | Student | Research Topic | Institution Name |
1
| MUKESH KUMAR | Design and Development of planar component using different microwave technology | Indian Institute of Engineering Science and Technology, Shibpur |
2
| Subhajit Chatterjee | 3D IC Technology and Related Issues | Indian Institute of Engineering Science and Technology, Shibpur |
3
| Abinash Tripathy | Self-cleaning and Bactericidal effect of Nano Structured Surface | Indian Institute of Science, Bangalore |
4
| Harshitha S K | Swarming behaviour in Pseudomonas aeruginosa | Indian Institute of Science, Bangalore |
5
| PAVANI VAMSI KRISHNA NITTALA | 3D die level packaging of heterogeneous systems | Indian Institute of Science, Bangalore |
6
| P Ravi Teja Reddy | Design for Testability of 3D-iC | Indian Institute of Technology, Hyderabad |
7
| Manish Bhendura | Interfacial Transport Phenomena during Phase Change in Multi-Porous Medium | Indian Institute of Technology, Kanpur |
8
| BASHEER AHMAD KHAN | Turbulent Flow and Conjugate Heat Transfer Over an Array of Discrete Three-dimensional Heat Sources of a Printed Circuit Board | Indian Institute of Technology, Kanpur |
9
| Gopinath Sahu | Liquid-vapor Phase-change Transport in Confined Liquid Plugs for Electronics Cooling Application | Indian Institute of Technology, Kanpur |
10
| Digvijay Shukla | single and two phase jet impingement cooling for thermal management of next generation high heat flux electronics | Indian Institute of Technology, Kanpur |
11
| Malkeet Singh | Experimental study of impingement cooling of electronic chips using synthetic jets | Indian Institute of Technology, Kanpur |
12
| Deepa Gupta | Design and fabrication of micro pin fins for heat transfer in electronic equipment | Indian Institute of Technology, Patna |
13
| Est Dev Patel | HEAT PIPE FOR ELECTRONICS COOLING | Indian Institute of Technology, Patna |
14
| Rishikesh Kumar | OPTIMUM DESIGN OF THERMOELECTRIC COOLING DEVICE | Indian Institute of Technology, Patna |
15
| Israr Ahmad | Thermal management of IC chip by EWOD | Indian Institute of Technology, Patna |
16
| Rahul Kumar | Electrical Modelling and Simulation of hybrid interconnect | Indian Institute of Technology, Ropar |
17
| Umesh Kumar Soni | Design and Control of High Speed Superefficient BLDC.PMSM Motor Drives | Motilal Nehru National Institute of Technology, Allahabad |
18
| Jyoti | Energy Efficient Protocols for WSAN | National Institute of Technology, Hamirpur |
19
| Praveen B | Thermal management of 3D IC packaging | National Institute of Technology, Tiruchirappalli |
20
| Vineeth Palliyembil | Performance analysis of Free Space Optical Communication Systems | National Institute of Technology, Tiruchirappalli |
Part Time Students |
S.No. | Student | Research Topic | Institution Name |
1
| Shambhu Kumar | THERMO-MECHANICAL RELIABILITY OF ELECTRONICS DEVICES | Indian Institute of Technology, Patna |
2
| Trivedi Shival Jayesh | Development of advance testing methodology for new Era of VLSI | Institute of Technology, Nirma University, Ahmedabad |
3
| Rajeev Kumar Dohare | Investigations on novel processes in flowing medium lasers using customized acquisition and analysis system | Jamia Millia Islamia, Delhi |
4
| Subhadeep Paul | Cooling of Electronic Componets | National Institute of Technology, Agartala |